TY  - CONF
A1  - Schuh, Günther
A1  - Stroh, Max-Ferdinand
A1  - Johanning, Lara
T1  - Framework To Design Compliance Rules For Digital Technologies In Manufacturing Companies
T2  - Procedia CIRP
N2  - Digital technologies such as 5G, augmented reality, and artificial intelligence (AI) are currently being used in various ways by manufacturing companies. As the fourth industrial revolution progresses, it has become apparent that reckless use and inadequate regulation of these technologies have a detrimental effect on the environment in which they are utilized. Therefore, regulation of digital technologies is imperative today to ensure more responsible and sustainable use. While governments usually establish regulations, progress is not keeping pace with the demands and hazards of employing digital technologies. The European AI law serves as an example of the considerable distance yet to be covered before binding guidelines are established. Consequently, companies must take proactive measures today to ensure that they use digital technologies responsibly in their environments. In this context, identifying which digital technologies are pertinent to manufacturing companies in terms of regulation is crucial. Furthermore, a comprehensive approach is required to design compliance holistically for digital technologies and to systematically derive the corresponding guidelines. This paper introduces a set of models that not only determine the importance of
compliance in the application of different technologies but also present a framework for methodically designing compliance. Furthermore, the paper contributes to the development of an AI platform in the German research project PAIRS by investigating the compliance relevance of applications such as artificial intelligence.
T3  - Procedia CIRP - 119 
KW  - digital technologies
KW  - industry 4.0
KW  - compliance
KW  - regulation
KW  - 5G
KW  - Industrie 4.0
KW  - rev
Y1  - 2023
UR  - https://epub.fir.de/frontdoor/index/index/docId/2794
UR  - https://www.sciencedirect.com/science/article/pii/S2212827123004535
SN  - 2212-8271
SP  - 103
EP  - 108
PB  - Elsevier
CY  - Amsterdam [u. a.]
ER  -